AM4376BZDND100 Texas Instruments

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Model: AM4376BZDND100

Order No:

SKU: 10000074998801

Category: Amplifier

Brand: TEXAS INSTRUMENTS

Size: 0.00CM, 0.00CM, 0.00CM

Weight: 0.00KG

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Features for the AM4376

Highlights
- Sitara™ ARM^® Cortex^®-A9 32-Bit RISC Processor With Processing Speed up to 1000 MHz
  - NEON™ SIMD Coprocessor and Vector Floating Point (VFPv3) Coprocessor
  - 32KB of Both L1 Instruction and Data Cache
  - 256KB of L2 Cache or L3 RAM
- 32-Bit LPDDR2, DDR3, and DDR3L Support
- General-Purpose Memory Support (NAND, NOR, SRAM) Supporting up to 16-Bit ECC
- SGX530 Graphics Engine
- Display Subsystem
- Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
- Real-Time Clock (RTC)
- Up to Two USB 2.0 High-Speed Dual-Role (Host or Device) Ports With Integrated PHY
- 10, 100, and 1000 Ethernet Switch Supporting up to Two Ports
- Serial Interfaces:
  - Two Controller Area Network (CAN) Ports
  - Six UARTs, Two McASPs, Five McSPIs, Three I²C Ports, One QSPI, and One HDQ or 1-Wire
- Security
  - Crypto Hardware Accelerators (AES, SHA, RNG, DES, and 3DES)
  - Secure Boot (Avaliable Only on AM437x High-Security [AM437xHS] Devices)
- Two 12-Bit Successive Approximation Register (SAR) ADCs
- Up to Three 32-Bit Enhanced Capture (eCAP) Modules
- Up to Three Enhanced Quadrature Encoder Pulse (eQEP) Modules
- Up to Six Enhanced High-Resolution PWM (eHRPWM) Modules
MPU Subsystem
- ARM Cortex-A9 32-Bit RISC Microprocessor With Processing Speed up to 1000 MHz
- 32KB of Both L1 Instruction and Data Cache
- 256KB of L2 Cache (Option to Configure as L3 RAM)
- 256KB of On-Chip Boot ROM
- 64KB of On-Chip RAM
- Secure Control Module (SCM) (Avaliable Only on AM437xHS Devices)
- Emulation and Debug
  - JTAG
  - Embedded Trace Buffer
- Interrupt Controller
On-Chip Memory (Shared L3 RAM)
- 256KB of General-Purpose On-Chip Memory Controller (OCMC) RAM
- Accessible to All Masters
- Supports Retention for Fast Wakeup
- Up to 512KB of Total Internal RAM
  (256KB of ARM Memory Configured as L3 RAM + 256KB of OCMC RAM)
External Memory Interfaces (EMIFs)
- DDR Controllers:
  - LPDDR2: 266-MHz Clock (LPDDR2-533 Data Rate)
  - DDR3 and DDR3L: 400-MHz Clock (DDR-800 Data Rate)
  - 32-Bit Data Bus
  - 2GB of Total Addressable Space
  - Supports One x32, Two x16, or Four x8 Memory Device Configurations
General-Purpose Memory Controller (GPMC)
- Flexible 8- and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, and SRAM)
- Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
- Uses Hamming Code to Support 1-Bit ECC
Error Locator Module (ELM)
- Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
- Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
- Supports Protocols such as EtherCAT^®, PROFIBUS^®, PROFINET^®, and EtherNet/IP™, EnDat 2.2, and More
- Two Programmable Real-Time Units (PRUs) Subsystems With Two PRU Cores Each
  - Each Core is a 32-Bit Load and Store RISC Processor Capable of Running at 200 MHz
  - 12KB (PRU-ICSS1), 4KB (PRU-ICSS0) of Instruction RAM With Single-Error Detection (Parity)
  - 8KB (PRU-ICSS1), 4KB (PRU-ICSS0) of Data RAM With Single-Error Detection (Parity)
  - Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator
  - Enhanced GPIO Module Provides Shift-In and Shift-Out Support and Parallel Latch on External Signal
- 12KB (PRU-ICSS1 Only) of Shared RAM With Single-Error Detection (Parity)
- Three 120-Byte Register Banks Accessible by Each PRU
- Interrupt Controller Module (INTC) for Handling System Input Events
- Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS
- Peripherals Inside the PRU-ICSS
  - One UART Port With Flow Control Pins, Supports up to 12 Mbps
  - One eCAP Module
  - Two MII Ethernet Ports that Support Industrial Ethernet, such as EtherCAT
  - One MDIO Port
- Industrial Communication is Supported by Two PRU-ICSS Subsystems
Power, Reset, and Clock Management (PRCM) Module
- Controls the Entry and Exit of Deep-Sleep Modes
- Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up Sequencing, and Power Domain Switch-On Sequencing
- Clocks
  - Integrated High-Frequency Oscillator Used to Generate a Reference Clock (19.2, 24, 25, and 26 MHz) for Various System and Peripheral Clocks
  - Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption
  - Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB, and Peripherals [MMC and SD, UART, SPI, I²C], L3, L4, Ethernet, GFX [SGX530], and LCD Pixel Clock)
- Power
  - Two Nonswitchable Power Domains (RTC and Wake-Up Logic [WAKE-UP])
  - Three Switchable Power Domains (MPU Subsystem, SGX530 [GFX], Peripherals and Infrastructure [PER])
  - Dynamic Voltage Frequency Scaling (DVFS)
Real-Time Clock (RTC)
- Real-Time Date (Day, Month, Year, and Day of Week) and Time (Hours, Minutes, and Seconds) Information
- Internal 32.768-kHz Oscillator, RTC Logic, and 1.1-V Internal LDO
- Independent Power-On-Reset (RTC_PWRONRSTn) Input
- Dedicated Input Pin (RTC_WAKEUP) for External Wake Events
- Programmable Alarm Can Generate Internal Interrupts to the PRCM for Wakeup or Cortex-A9 for Event Notification
- Programmable Alarm Can Be Used With External Output (RTC_PMIC_EN) to Enable the Power-Management IC to Restore Non-RTC Power Domains
Peripherals
- Up to Two USB 2.0 High-Speed Dual-Role (Host or Device) Ports With Integrated PHY
- Up to Two Industrial Gigabit Ethernet MACs
  (10, 100, and 1000 Mbps)
  - Integrated Switch
  - Each MAC Supports MII, RMII, and RGMII and MDIO Interfaces
  - Ethernet MACs and Switch Can Operate Independent of Other Functions
  - IEEE 1588v2 Precision Time Protocol (PTP)
- Up to Two CAN Ports
  - Supports CAN Version 2 Parts A and B
- Up to Two Multichannel Audio Serial Ports (McASPs)
  - Transmit and Receive Clocks up to 50 MHz
  - Up to Four Serial Data Pins Per McASP Port With Independent TX and RX Clocks
  - Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
  - Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
  - FIFO Buffers for Transmit and Receive (256 Bytes)
- Up to Six UARTs
  - All UARTs Support IrDA and CIR Modes
  - All UARTs Support RTS and CTS Flow Control
  - UART1 Supports Full Modem Control
- Up to Five Master and Slave McSPIs
  - McSPI0–McSPI2 Support up to Four Chip Selects
  - McSPI3 and McSPI4 Support up to Two Chip Selects
  - Up to 48 MHz
- One Quad-SPI
  - Supports eXecute In Place (XIP) from Serial NOR FLASH
- One Dallas 1-Wire^® and HDQ Serial Interface
- Up to Three MMC, SD, and SDIO Ports
  - 1-, 4-, and 8-Bit MMC, SD, and SDIO Modes
  - 1.8- or 3.3-V Operation on All Ports
  - Up to 48-MHz Clock
  - Supports Card Detect and Write Protect
  - Complies With MMC4.3 and SD and SDIO 2.0 Specifications
- Up to Three I²C Master and Slave Interfaces
  - Standard Mode (up to 100 kHz)
  - Fast Mode (up to 400 kHz)
- Up to Six Banks of General-Purpose I/O (GPIO)
  - 32 GPIOs per Bank (Multiplexed With Other Functional Pins)
  - GPIOs Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank)
- Up to Three External DMA Event Inputs That Can Also be Used as Interrupt Inputs
- Twelve 32-Bit General-Purpose Timers
  - DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks
  - DMTIMER4–DMTIMER7 are Pinned Out
- One Public Watchdog Timer
- One Free-Running, High-Resolution 32-kHz Counter (synctimer32K)
- One Secure Watchdog Timer (Avaliable Only on AM437xHS Devices)
- SGX530 3D Graphics Engine
  - Tile-Based Architecture Delivering up to 20M Poly/sec
  - Universal Scalable Shader Engine is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality
  - Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0
  - Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0
  - Fine-Grained Task Switching, Load Balancing, and Power Management
  - Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction
  - Programmable High-Quality Image Anti-Aliasing
  - Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture
- Display Subsystem
  - Display Modes
    - Programmable Pixel Memory Formats (Palletized: 1-, 2-, 4-, and 8-Bits Per Pixel; RGB 16- and 24-Bits Per Pixel; and YUV 4:2:2)
    - 256- × 24-Bit Entries Palette in RGB
    - Up to 2048 × 2048 Resolution
  - Display Support
    - Four Types of Displays Are Supported: Passive and Active Colors; Passive and Active Monochromes
    - 4- and 8-Bit Monochrome Passive Panel Interface Support (15 Grayscale Levels Supported Using Dithering Block)
    - RGB 8-Bit Color Passive Panel Interface Support (3,375 Colors Supported for Color Panel Using Dithering Block)
    - RGB 12-, 16-, 18-, and 24-Bit Active Panel Interface Support (Replicated or Dithered Encoded Pixel Values)
    - Remote Frame Buffer (Embedded in the LCD Panel) Support Through the RFBI Module
    - Partial Refresh of the Remote Frame Buffer Through the RFBI Module
    - Partial Display
    - Multiple Cycles Output Format on 8-, 9-, 12-, and 16-Bit Interface (TDM)
  - Signal Processing
    - Overlay and Windowing Support for One Graphics Layer (RGB or CLUT) and Two Video Layers (YUV 4:2:2, RGB16, and RGB24)
    - RGB 24-Bit Support on the Display Interface, Optionally Dithered to RGB 18‑Bit Pixel Output Plus 6-Bit Frame Rate Control (Spatial and Temporal)
    - Transparency Color Key (Source and Destination)
    - Synchronized Buffer Update
    - Gamma Curve Support
    - Multiple-Buffer Support
    - Cropping Support
    - Color Phase Rotation
- Two 12-Bit SAR ADCs (ADC0, ADC1)
  - 867K Samples Per Second
  - Input Can Be Selected from Any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch
  - ADC0 Can Be Configured to Operate as a 4‑, 5-, or 8-Wire Resistive Touch Screen Controller (TSC)
- Up to Three 32-Bit eCAP Modules
  - Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs
- Up to Six Enhanced eHRPWM Modules
  - Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls
  - Configurable as Six Single-Ended, Six Dual-Edge Symmetric, or Three Dual-Edge Asymmetric Outputs
- Up to Three 32-Bit eQEP Modules
Device Identification
- Factory Programmable Electrical Fuse Farm (FuseFarm)
  - Production ID
  - Device Part Number (Unique JTAG ID)
  - Device Revision (Readable by Host ARM)
  - Security Keys (Avaliable Only on AM437xHS Devices)
  - Feature Identification
Debug Interface Support
- JTAG and cJTAG for ARM (Cortex-A9 and PRCM) and PRU-ICSS Debug
- Supports Real-Time Trace Pins (for Cortex-A9)
- 64-KB Embedded Trace Buffer (ETB)
- Supports Device Boundary Scan
- Supports IEEE 1500
DMA
- On-Chip Enhanced DMA Controller (EDMA) Has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels
- EDMA is Used for:
  - Transfers to and from On-Chip Memories
  - Transfers to and from External Storage (EMIF, GPMC, and Slave Peripherals)
InterProcessor Communication (IPC)
- Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between the Cortex-A9, PRCM, and PRU-ICSS
Boot Modes
- Boot Mode is Selected Through Boot Configuration Pins Latched on the Rising Edge of the PWRONRSTn Reset Input Pin
Camera
- Dual Port 8- and 10-Bit BT656 Interface
- Dual Port 8- and 10-Bit Including External Syncs
- Single Port 12-Bit
- YUV422/RGB422 and BT656 Input Format
- RAW Format
- Pixel Clock Rate up to 75 MHz
Package
- 491-Pin BGA Package (17-mm × 17-mm) (ZDN Suffix), 0.65-mm Ball Pitch With Via Channel Array Technology to Enable Low-Cost Routing